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1

Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging

Cui, Hui-wang, Fan, Qiong, Li, Dong-sheng, Tang, Xin

Journal:

The Journal of Adhesion

Year:

2013

Language:

english

File:

PDF, 1.03 MB

english, 2013

2

Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging

Cui, Hui-Wang, Du, Wen-Hui

Journal:

The Journal of Adhesion

Year:

2013

Language:

english

File:

PDF, 963 KB

english, 2013

3

Highly stretchable, electrically conductive textiles fabricated from silver nanowires and cupro fabrics using a simple dipping-drying method

Cui, Hui-Wang, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

Year:

2015

Language:

english

File:

PDF, 4.00 MB

english, 2015

4

Preparation and characterization of exfoliated nanocomposite of polyvinyl acetate and organic montmorillonite

Hui-Wang Cui, Guan-Ben Du

Journal:

Advances in Polymer Technology

Year:

2012

Language:

english

File:

PDF, 330 KB

english, 2012

5

Reliability of flexible electrically conductive adhesives

Hui-wang Cui, Dong-sheng Li, Qiong Fan

Journal:

Polymers for Advanced Technologies

Year:

2012

Language:

english

File:

PDF, 554 KB

english, 2012

6

Adhesion of a novel flexible epoxy molding compound and its molecular dynamics simulation

Hui-wang Cui, Dong-sheng Li, Qiong Fan

Journal:

International Journal of Adhesion and Adhesives

Year:

2012

Language:

english

File:

PDF, 651 KB

english, 2012

7

Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

Hui-wang Cui, Dong-sheng Li, Qiong Fan

Journal:

Electronic Materials Letters

Year:

2013

Language:

english

File:

PDF, 1.80 MB

english, 2013

8

Preparation and Characterization of a Novel Epoxy Molding Compound with Low Storage Modulus at High Temperature and Low Glass-Transition Temperature

Hui-wang Cui, Dong-sheng Li, Qiong Fan

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 312 KB

english, 2012

9

High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic package

Cui, Hui-Wang, Kowalczyk, Agnieszka, Li, Dong-Sheng, Fan, Qiong

Journal:

International Journal of Adhesion and Adhesives

Year:

2013

Language:

english

File:

PDF, 943 KB

english, 2013

10

Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging

Cui, Hui-Wang, Li, Dong-Sheng, Fan, Qiong, Lai, Hua-Xiang

Journal:

International Journal of Adhesion and Adhesives

Year:

2013

Language:

english

File:

PDF, 475 KB

english, 2013

11

Novel flexible electrically conductive adhesives from functional epoxy, flexibilizers, micro-silver flakes and nano-silver spheres for electronic packaging

Cui, Hui-wang, Fan, Qiong, Li, Dong-sheng

Journal:

Polymer International

Year:

2013

Language:

english

File:

PDF, 529 KB

english, 2013

12

Influence of different synthesis processes on the rheology of PVAc–MMT–DOAB exfoliated nano-composite

Cui, Hui-Wang, Du, Guan-Ben

Journal:

Iranian Polymer Journal

Year:

2013

Language:

english

File:

PDF, 544 KB

english, 2013

13

Rheology of PVAc–MMT–STAB

Cui, Hui-Wang, Du, Guan-Ben

Journal:

Journal of Adhesion Science and Technology

Year:

2011

Language:

english

File:

PDF, 215 KB

english, 2011

14

Using a functional epoxy, micron silver flakes, nano silver spheres, and treated single-wall carbon nanotubes to prepare high performance electrically conductive adhesives

Hui-Wang Cui, Dong-Sheng Li, Qiong Fan

Journal:

Electronic Materials Letters

Year:

2013

Language:

english

File:

PDF, 2.16 MB

english, 2013

15

Nanocomposites of polybenzoxazine and exfoliated montmorillonite using a polyhedral oligomeric silsesquioxane surfactant and click chemistry

Hui-Wang Cui, Shiao-Wei Kuo

Journal:

Journal of Polymer Research

Year:

2013

Language:

english

File:

PDF, 1.45 MB

english, 2013

16

Development of a novel polyvinyl acetate type emulsion curing agent for urea formaldehyde resin

Hui-wang Cui, Guan-ben Du

Journal:

Wood Science and Technology

Year:

2013

Language:

english

File:

PDF, 342 KB

english, 2013

17

Montmorillonite reinforced phenol formaldehyde resin: Preparation, characterization, and application in wood bonding

Fang, Qun, Cui, Hui-wang, Du, Guan-ben

Journal:

International Journal of Adhesion and Adhesives

Year:

2014

Language:

english

File:

PDF, 1.14 MB

english, 2014

18

Complementary multiple hydrogen bonds stabilize thermo-sensitive supramolecular structures prepared from poly(N-isopropyl acrylamide) and adenine-functionalized poly(ethylene oxide)

Cui, Hui-Wang, Chu, Wee-Cheng, Chen, Jem-Kun, Kuo, Shiao-Wei

Journal:

European Polymer Journal

Year:

2014

Language:

english

File:

PDF, 1.35 MB

english, 2014

19

Rheology of exfoliated nanocomposite of polyvinyl acetate and organic montmorillonite synthesized by different processes

Cui, Hui-Wang, Du, Guan-Ben

Journal:

Polymer Bulletin

Year:

2014

Language:

english

File:

PDF, 813 KB

english, 2014

20

Using polyurethane, ethylene-vinyl acetate hotmelt, and nano hexagonal boron nitride particles to electrospin high surface adhesion polymer fibers

Cui, Hui-Wang, Tang, Xin

Journal:

Electronic Materials Letters

Year:

2014

Language:

english

File:

PDF, 798 KB

english, 2014

21

Using Agrawal integral equation, dynamic mechanical analysis (DMA), and differential scanning calorimeter (DSC) methods to study the glass transition kinetics of nanocomposites of polybenzoxazine and exfoliated montmorillonite from a polyhedral oligomeric silsesquioxane surfactant and click chemistry

Cui, Hui-Wang, Kuo, Shiao-Wei

Journal:

Applied Clay Science

Year:

2014

Language:

english

File:

PDF, 657 KB

english, 2014

22

Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package

Cui, Hui-Wang, Fan, Qiong, Li, Dong-Sheng

Journal:

International Journal of Adhesion and Adhesives

Year:

2014

Language:

english

File:

PDF, 1.46 MB

english, 2014

23

Using Agrawal integral equation and thermogravimetric analysis (TGA) to study the pyrolysis kinetics of nanocomposites of polybenzoxazine and exfoliated montmorillonite from a mono-functionalized azide polyhedral oligomeric silsesquioxane and click chemistry

Cui, Hui-Wang, Kuo, Shiao-Wei

Journal:

Polymer Bulletin

Year:

2013

Language:

english

File:

PDF, 327 KB

english, 2013

24

Rheological kinetics of thermo-sensitive supramolecular assemblies from poly(N-isopropyl acrylamide) and adenine-functionalized poly(ethylene oxide) stabilized by complementary multiple hydrogen bonds

Cui, Hui-Wang, Kuo, Shiao-Wei

Journal:

Korea-Australia Rheology Journal

Year:

2014

File:

PDF, 2.48 MB

2014

25

Using Ozawa method to study the curing kinetics of electrically conductive adhesives

Hui-Wang Cui,Jin-Ting Jiu,Shijo Nagao…

Journal:

Journal of Thermal Analysis and Calorimetry

Year:

2014

Language:

english

File:

PDF, 721 KB

english, 2014

26

Using Agrawal integral equation to study the pyrolysis kinetics of exfoliated montmorillonite from a polyhedral oligomeric silsesquioxane surfactant and click chemistry

Cui, Hui-Wang, Kuo, Shiao-Wei

Journal:

Applied Clay Science

Year:

2014

Language:

english

File:

PDF, 757 KB

english, 2014

27

Using the Friedman method to study the thermal degradation kinetics of photonically cured electrically conductive adhesives

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi, Schroder, Kurt A.

Journal:

Journal of Thermal Analysis and Calorimetry

Year:

2015

Language:

english

File:

PDF, 1.11 MB

english, 2015

28

Using a polyhedral oligomeric silsesquioxane surfactant and click chemistry to exfoliate montmorillonite

Cui, Hui-Wang, Kuo, Shiao-Wei

Journal:

Year:

2012

Language:

english

File:

PDF, 993 KB

english, 2012

29

Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

Cui, Hui-Wang, Jiu, Jin-Ting, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Uchida, Hiroshi, Schroder, Kurt A.

Journal:

Year:

2014

Language:

english

File:

PDF, 1.91 MB

english, 2014

30

Exfoliated Nanocomposites of Polyvinyl Acetate- N -Hydroxymethyl Acrylamide and Intercalated Montmorillonite from an Octadecyl Trimethyl Ammonium Bromide Surfactant

Cui, Hui-Wang, Fang, Qun, Du, Guan-Ben

Journal:

Polymer-Plastics Technology and Engineering

Year:

2014

Language:

english

File:

PDF, 2.63 MB

english, 2014

31

Synthesis and Characterization of PVAc-MMT-DOAB Exfoliated Nanocomposites: Reducing Polymerization Time and Water in the Synthesis

Cui, Hui-Wang, Du, Guan-Ben

Journal:

Advances in Polymer Technology

Year:

2013

Language:

english

File:

PDF, 604 KB

english, 2013

32

Influence of Synthesis Processes on the Properties of PVAc-MMT-STAB Exfoliated Nanocomposites

Cui, Hui-Wang, Du, Guan-Ben

Journal:

Polymer-Plastics Technology and Engineering

Year:

2013

Language:

english

File:

PDF, 800 KB

english, 2013

33

Super flexible, highly conductive electrical compositor hybridized from polyvinyl alcohol and silver nano wires

Cui, Hui-Wang, Jiu, Jin-Ting, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

Year:

2015

Language:

english

File:

PDF, 1.91 MB

english, 2015

34

Dynamic Mechanical and Thermal Kinetics of Polyvinyl Acetate Type Emulsions from Vinyl Acetate, N -hydroxymethyl Acrylamide, and Montmorillonite

Cui, Hui-Wang, Fang, Qun, Du, Guan-Ben

Journal:

Advances in Polymer Technology

Year:

2014

Language:

english

File:

PDF, 601 KB

english, 2014

35

Using the Ozawa method to study the thermally initiated curing kinetics of vinyl ester resin

Cui, Hui-Wang, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

Year:

2015

Language:

english

File:

PDF, 1.47 MB

english, 2015

36

‘Chrysanthemum petal’ arrangements of silver nano wires

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

Year:

2014

Language:

english

File:

PDF, 3.57 MB

english, 2014

37

Secondary and ternary emulsions from vinyl acetate,N-hydroxymethyl acrylamide, and urea for wood bonding

Cui, Hui-Wang, Fang, Qun, Du, Guan-Ben

Journal:

Wood Science and Technology

Year:

2014

Language:

english

File:

PDF, 358 KB

english, 2014

38

Solidification and thermal degradation of printable, stretchable electrical conductor from waterborne polyurethane and silver flakes

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi, Kihara, Katsunori

Journal:

Journal of Thermal Analysis and Calorimetry

Year:

2015

Language:

english

File:

PDF, 1.62 MB

english, 2015

39

High performance heat curing copper-silver powders filled electrically conductive adhesives

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

Electronic Materials Letters

Year:

2015

Language:

english

File:

PDF, 2.04 MB

english, 2015

40

Development of an Exfoliated Nanocomposite Prepared by Vinyl Acetate and Organic Montmorillonite: Structure, Dynamic Mechanical Properties and Thermal Degradation

Cui, Hui-Wang, Du, Guan-Ben

Journal:

Composite Interfaces

Year:

2011

Language:

english

File:

PDF, 2.66 MB

english, 2011

41

Surface wettability, surface free energy, and surface adhesion of microwave plasma-treatedPinus yunnanensiswood

Fang, Qun, Cui, Hui-Wang, Du, Guan-Ben

Journal:

Wood Science and Technology

Year:

2016

Language:

english

File:

PDF, 609 KB

english, 2016

42

Using Vinyl Acetate, N -Hydroxymethyl Acrylamide, and Montmorillonite Intercalated by a Dioctadecyl Dimethyl Ammonium Bromide Surfactant to Prepare Exfoliated Nanocomposite through In Situ Polymerization

CUI, HUI-WANG, FANG, QUN, DU, GUAN-BEN

Journal:

Advances in Polymer Technology

Year:

2015

Language:

english

File:

PDF, 1.08 MB

english, 2015